PCB Fabrication and Back-end Processing

L1000551

 New user please fill out, print, and bring the PI signed form to the Center. You will also need to obtain a valid recharge ID

PCB Fabrication and Back-end Processing

Silicon, Ceramic, Glass, Sapphire, and many other materials can be diced using Disco DAD321 dicing saw. Wire bonder (TPT HB16) and wedge bonder (Westbond) are available for wedge/ball wire bonding (wire/ribbon, Al/Au).

Dicing Rates:(No substrates with III-V toxic compounds)

Internal Users (UCLA students and faculty): $160/job + labor $30/hour

External Users (Industry and private ventures): $320/job + labor $60/hour

 

General Fabrication Facilities:

Internal Users: $100/month or $50/use

External Users: $100/use

LPKF Protomat Milling Machine:

Internal Users: $40 + materials + labor

External Users: $80 + materials + labor

LPKF ProtoLaser U4:

Internal Users: $200 + materials + labor

External Users: $400 + materials + labor

Wirebonding Rate:

Internal Users: $2/wire, $3/wire for under 10 wires 

External Users: $3/wire

Labor Rates(Urgent job will add one hour labor):

Internal Users: $30/hour

External Users: $60/hour